Multi-layer PCB align can be inspected with X-ray inspection system. With 2D X-ray image (left), layer offset can be detected. With 3D CT, each layer is visualized with different image and any offset layer can be detected with layer number information. Right image shows offset layer.
PCB Via Hole Align (2D and 3D CT)
With 3D CT, each layer of PCB is visualized without any overlapping. Critical defects such as pattern open/short, or via hole alignment can be perfectly observed.
Multi-layer Board slice image - Visualization of each layer
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